Electronics Forum | Tue Oct 18 15:50:01 EDT 2022 | smith88
IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Sat Nov 04 19:48:15 EST 2006 | Dhanish
Can someone educate me what is 1)glass wicking failure on PCB 2)Crack of TH Barrel How it happens and how this can be rosolved?
Electronics Forum | Tue Mar 28 14:23:11 EDT 2023 | smith88
Glass Micro BGA- I consistently have chips or micro cracks from the manufacture and some happen during install, what functionality risk do these pose to the product? They pass test... I cannot find an established criteria for this type of component
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Tue Jun 17 09:22:02 EDT 2003 | davef
Higher that recommended is more brittle. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17906 Q2: Will some of my Ceramic Caps crack during the wave soldering process because of the heat? A2: Probably Q3: Can you see any pos
Electronics Forum | Tue Sep 24 17:57:35 EDT 2013 | nophsem
Hi: I've disarmed the CyberOptics laser and I founded the problem. Protecting Infrared glass was cracked it inside. I've replaced it with a new one and solved the problem. Thank you very much for the help and hope that this post will be useful to som
Electronics Forum | Tue Dec 19 11:49:46 EST 2023 | jeana
Hi Everyone ! On our endeavor to get reliable pick and placing with our "new" Quad IVc, we got weird behaviours of the QuadAlign system. When we received the machine the glass of the laser side was cracked, so we removed it and it started working
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Mon Apr 12 22:22:01 EDT 2004 | davef
Large voids are common in via in pad [seach the fine SMTnet Archives for earlier laments], especially in blind via. Observations on your via out gassing theory: * If the copper plating on your via is GT 1 thou, there will be no outgassing from the
