Electronics Forum | Thu Feb 03 06:21:57 EST 2000 | Ignacio Simon
I would like to have information about the materials commonly used for laminates of printed circuit boards, their main thermal, mechanical, humidity and electrical characteristics and proper finishing and aplicattions, and advantages/disadvantages be
Electronics Forum | Thu Feb 15 22:55:45 EST 2007 | davef
Questions are: * Is the blistering in the solder mask or the laminate? * If the blistering is in the solder mask, what do the blisters look like [eg, size, quantity, distribution, etc]? * If the blistering is in the laminate, what do the blisters loo
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Wed Feb 21 05:52:17 EST 2007 | Stephen- SMT engineer trainee
Some of the blister in solder mask, normally 1 circle blister(about 1cm in Dim.) in each PCB. In addition, there are also blister in laminate, the also look like 1 circle blister(about 1cm in Dim.) in each PCB.
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Wed May 28 08:25:08 EDT 2003 | davef
That's what we do [no more than three reworks or mods]. Your "four reworks permissable" was probably based on the 55110 five thermal cycles, counting wave soldering as the first cycle. How do you plan to keep track of each of those rework actions?
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Thu Feb 03 21:20:50 EST 2000 | Dave F
Ignacio: Try: Electronic Packaging & Interconnection Handbook, Harper, (ISBN 0070266948) Printed Circuit Board Materials Handbook Jawitz, MW McGraw-Hill 1997 (ISBN 0070324883) merix.com/resourcecntr/materials/mtl_property_comp.html norplex.com/TD_L
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Electronics Forum | Tue Apr 13 18:11:00 EDT 1999 | Jimmy Strain
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185
