Electronics Forum: discrete components date code acceptability (Page 1 of 1)

Re: SMD reeled components

Electronics Forum | Wed Feb 09 21:41:27 EST 2000 | Dave F

Jack: You should use your components promptly. Don't store 'em, only bad things will happen to them. 1 You should store all your components, not just your SMD reeled components, so they are not damaged or their solderability decreased. Check the

12 Year Old Components?

Electronics Forum | Fri Sep 13 09:02:52 EDT 2002 | tvielhaber

A distributor has some smt components (QFP) packaged in a vacuum sealed package with a 1991 date code. Should I accept these parts? What are the main issues I need to be concerned about? Solerability, moisture? Won't the vaccum seal package minim

Re: Component Shelf Life

Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

component shelf life

Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

Non-wetting on 0402 chips capacitors

Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef

Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

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