Electronics Forum: disocolored leads after reflow (Page 1 of 42)

pull strength on leads

Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia

Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.

QFP w/ oxidized leads

Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox

Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball

pb free component leads

Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg

Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process

AOI inspection after reflow

Electronics Forum | Mon Apr 01 10:15:22 EDT 2013 | babe7362000

I have to agree with you. We do go by piece rate not by time. Also who is supposed to make a process, the Man.Eng., or the lead? I would think the Man. Eng and the lead should make sure everyone is following it?

Pasteproblem after reflow

Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs

have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.

Reducing Warp after reflow

Electronics Forum | Thu Oct 13 15:38:18 EDT 2022 | proceng1

Do you have the ability to add copper thieving or otherwise balance the design? We had a customer making LED boards with a terible inbalance. Some of the boards would "smile" so badly in the oven that the leading edge touched the top. They switche

board delaminated after reflow

Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036

2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right

board delaminated after reflow

Electronics Forum | Wed Apr 08 09:28:25 EDT 2009 | swag

We had the exact same problem in early stages of lead-free. Very random positions of defect + some boards were 100% O.K. and others were an explosion of what I see in your picture. Turned out to be bad processing/materials from board house. I'm do

board delaminated after reflow

Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse

Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What

board delaminated after reflow

Electronics Forum | Wed Apr 08 14:46:34 EDT 2009 | boardhouse

The things to ask your board supplier would be: 1) Was the Pre-preg material that was used on this board within its Shelf life? and ask for the Incoming inspection CofC for the Pre-preg material. 2)Was this order shipped from Stock - this is why

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