Electronics Forum | Tue Jul 01 13:45:12 EDT 2008 | realchunks
The actual solder joint occurs BETWEEN the part and the pad. Adding more solder on top will add strength slightly, just by being in the way when you pull on it sideways. A weak joint with a weeks worth of solder on it will still be weak. Solder is
Electronics Forum | Wed Aug 27 13:03:10 EDT 2008 | adamcrum
My company recieved an old Camalot dispensing system from a company that we are now building boards for. It is OLD and runs a DOS. I have managed to set up the machine without directions, and have even built a program for it, but I can't get it to ru
Electronics Forum | Tue Dec 09 08:51:56 EST 2008 | pjc
256 LT or Lite, low end fully auto machine, lower res alignment camera, not as accurate and repeatable as GSX. Wiper and Auto Paste dispensing optional. GSX is fully loaded with hi end camera alignment, auto paste, vac stencil wiper, may have auto fl
Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef
In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics
Electronics Forum | Fri Feb 20 11:51:15 EST 2009 | markhoch
Okay, I've done extensive Google and SMTnet Archive searches, and I've turned up nothing but Patent Ideas. We've got a new application with which I'd like to fill a cavity containing a wire with molten solder. The cavity is housed within a large Mil
Electronics Forum | Fri Feb 20 12:04:29 EST 2009 | markhoch
Okay, after taking an actual minute to think about my suggestion, it has dawned on me that filling a metal cavity with molten solder to make a solder connection is not a good idea. By doing so I wouldn't be giving the metal cavity sufficient time to
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Mon Aug 24 07:32:34 EDT 2009 | hurr
Hi Joane, this flux is primarily designed for wave soldering. I think that manual soldering it´s possible. Certainly it´s very hard to dispensing correct amount of the flux. Succinic acid is one from all ingredients of this flux. If you have this
Electronics Forum | Mon Oct 26 06:27:50 EDT 2009 | bandjwet
SMTnetters: Does anyone have experience in the average programming time that they use for calculating costs on using a solder dispense and place process for QFN rework? How about average cycle time from start to finish for same? We are comparing it
