Electronics Forum | Thu May 03 12:59:55 EDT 2018 | donnie15
Our customer is asking for a solder ball dispersion test on our string solder for rework. The do not provide a test spec, only the attached diagram? has anyone seen this before? It looks like just pushing the solder against the iron and counting th
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Electronics Forum | Mon Oct 21 09:58:28 EDT 2002 | cnoonan
We hare having an issue with our chip shooters misplacing or not placing parts all together. We have traced it back to our adhesive machine. We are using both single and double dot nozzles. I feel that the biggest problem is excessive amounts of g
Electronics Forum | Thu May 01 17:25:10 EDT 2003 | davef
Our first choice in determining the composition of metals would be to use Scanning Electron Microscopy (SEM) / Energy Dispersive Spectroscopy (EDS) analysis.
Electronics Forum | Mon Apr 25 21:52:58 EDT 2005 | KEN
I wonder if yor customer means wrong "flux"? Your not solderng to gold. Your soldering to Nickle. The gold is disolved and dispersed. Your joint strength comes from the SnNi intermetalic.
Electronics Forum | Thu Mar 22 11:23:42 EDT 2007 | Stefan
Hi, Can somebody tell if for melf components the x and z sizes are the same? Normally they are, but the machine's vision system sees only 60-70% of the x size due to light dispersion. The Z dimension has to be the one measured with a vernier caliper?
Electronics Forum | Wed Sep 02 11:54:34 EDT 2009 | davef
You can determine empirically what will work. * Use ion chromatography [IPC-TM-650 2.3.28] to evaluate the residues and determine if the residues must be removed. * Use energy dispersive spectroscopy for the elemental analysis or chemical characteriz
Electronics Forum | Tue Jul 05 17:43:43 EDT 2011 | davef
We agree. As Bill says, given that you seem to have bubbles in a restricted area and not broadly dispersed across your board, this seems to indicate an interaction between process materials, rather than a cure or thickness issue.
Electronics Forum | Fri May 04 10:10:18 EDT 2018 | donnie15
Thanks for your response, I changed the attachment to a PDF. It will be easy enough to set up if we need to do this. I was hoping the test was a little more formal and documented but quick and dirty evaluation have their place as well.
Electronics Forum | Sat Mar 17 15:12:33 EST 2001 | robhal
First thing to check is that you have a good gasket between the PCB and the stencil (if not check that the tactile is free of paste at the base of it and calibrate the tactile. I am assuming it is not a head mounted tactile) Also check that the wipe
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