Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Fri Feb 03 17:47:06 EST 2006 | Brian Smith
Kester offers Tin-Copper AND Tin-Copper-Nickel. The Kester K100 alloy is a Tin-Copper-Nickel material that is very similar to SN100C. Straight Tin-Copper isn't tremendously popular but can be used in low-cost, consumer-electronics applications wher
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Mon Nov 19 09:34:50 EST 2007 | bbarton
Real Chunks...Yes, that's the most glaringly obvious defect in the short term (you'll probably find it on your production floor if it's really bad) but you may find that everything looks good short term only to have a high level of customer returns..
