Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Fri Jul 12 01:38:06 EDT 2002 | redmary
thanks, Dave. who are specialized in mechnical stress distribution? because I find the gap in the capacitor, but why? If the crack is caused by the exteral mechnical stress, which shape will be formed, zigzag or linear?
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
Electronics Forum | Thu Oct 18 10:40:27 EDT 2018 | emeto
David, you can beat around the bush interpreting criteria, but without X-ray you will not see anything. This is the way to go to inspect this solder joints properly. Criteria is 75% fillet and than you have circumference, air gaps in there....
Electronics Forum | Thu Feb 24 15:36:34 EST 2022 | dontfeedphils
Looks like a decent profile. Only recommendation I have would be to possibly try and high-temp solder the thermocouples rather than the aluminum tape/kapton, only because you can get air-gaps and inaccurate readings using the tape method on assemble
Electronics Forum | Wed Mar 26 09:26:12 EDT 2008 | lloyd
I know you said you checked your clamps but another look will do no harm. we had a very similar issue a while back, and it turned out that the plastic shim under the chase clamp magnet was damaged. This caused the chase clamps not to release properly
Electronics Forum | Thu Jan 29 16:52:53 EST 2004 | davef
Air Power distributer Pyles caulking guns. One Air Power office is: Air Power, Inc. 107 Woodruff Industrial Lane Greenville, SC 29607 Phone: (864) 234-5456 Toll Free: (888) 731-4836 Fax: (864) 281-0545 Henry Sutherland, Branch Mgr. We have no rela
Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Wed Jun 09 14:51:08 EDT 1999 | Earl Moon
| Does anyone have thoughts on BGA rework. We now use the OK BGA 3000 and now am considering an Infrared machine. Any thoughts? | I've used Pace, Conceptronic and, now, SRT machines. Bottom side IR is OK. Better thermal balance is achieved with hot
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
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