Electronics Forum | Sat Aug 13 11:14:11 EDT 2005 | Ftiscar
Does any body knows if there is a design rule on copper pads against component weight so they do not drop on secon reflow process?
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Mon Aug 14 01:49:14 EDT 2000 | Joe
G'day, I am interested in hearing about the automatic lubrication of the chains in a reflow oven. The systems I have seem to work to a certain degree. They either lubricate too much, so we end up getting oil on the edges of the PCB, or not enough, w
Electronics Forum | Thu May 13 20:38:32 EDT 1999 | lima
Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? My concern is the volatiles in my WS629 solder paste may be attacking th
Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima
| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be
Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
Electronics Forum | Mon Aug 25 20:49:27 EDT 2003 | msimkin
Anyone use glass filled nylon connectors utilising the intrusive reflow techique (pin in paste). We are having probe with them becoming brittle after reflow- apparently due to moisture. We are also seeing bubbling on outside plastic.Peak oven temp 22
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Tue Aug 26 11:15:47 EDT 2003 | blnorman
We use HTN (high temperature nylon - Zytel) connectors in our reflow ovens with no warping, bubbling, or cracking. You can also use PPA (Amodel).
