Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Tue Feb 11 13:41:54 EST 2003 | Stephen
How are you doing things now? I'm trying to picture a place going from no reflow oven to a reflow oven without also getting a screen printer at the same time. Are you now handsoldering parts on? With these batchs you plan on doing are you going to
Electronics Forum | Tue Aug 10 16:57:29 EDT 1999 | JohnW
| | Does anyone use reflow profilers? Are they a good investement or is trial and error sufficient? | | | | Does anyone have any suggestions on profiles to try? Thanks. | | | Danielm | I would hazard a guess that most if not all of us production f
Electronics Forum | Mon Jun 18 11:54:35 EDT 2007 | grantp
Hi, The problem seemed to be across multiple batches of boards, so I think they were made correctly, and we don't use a carrier in the reflow oven. However we just moved our equipment to the new factory yesterday, and connect and start turning on
Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Mon Apr 12 07:44:50 EDT 2004 | wgaffubar
Former company we use to replace No Lead BGA's by using dot dispense to apply eutectic solder to pad with same volume the stencil printer. Current company process removes bad BGA, wicks off solder paste then Hot Gas Reflows new No Lead BGA to bare pa
Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist
The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes
Electronics Forum | Thu Nov 29 10:40:46 EST 2001 | franciscoioc
I have a datapaq 2000 profiler with a version 1.31 software and it saids it can only be used with windows 3.1. Does anyone have a copy of a later version software that i can use on windows 98 for this profiler.
Electronics Forum | Mon Apr 21 23:08:03 EDT 2008 | dman97
Hi, Does anyone know what kind of cable the thinline profiler uses? I recently acquired one of these profilers, but it came with no cables. I went out and bought a female to female serial cable, but it did not work. It will not communicate with my P
Electronics Forum | Tue Feb 22 07:19:51 EST 2005 | austinj
I have been profiling with the fixture. I have performed multiple DOE runs and came up with the following with success: Cooled soak zone to max 150C for approx 100sec. and spiked reflow zone for max temp of 230C, pcb/panel is above 183C for 64sec.
