Electronics Forum | Tue Jan 25 09:15:02 EST 2005 | Marc A
Good info, thanks for passing along. The company I work for (equipment supplier) ran some tests with lead free material in air and N2 environements for reflow. In the air reflow environement it was noticed that the material does not spread, much li
Electronics Forum | Thu Jan 27 15:13:26 EST 2005 | jbrower
Hi Tom, Thanks for the compliment. I've been researching and planning for the time that my company would go lead free since late in 1999. I hear you there, how do we know that the component is lead free. Baring a leap of faith with your vendors, I
Electronics Forum | Tue Feb 01 12:43:39 EST 2005 | jbrower
Hi Scott, My Heller is a bog standard Heller 1500 with an edge guide. There is nothing special about it. I would of course love to have a 7 zone oven, but...I have to use what is here at this time. My only concern with a 5 zone oven is the change i
Electronics Forum | Tue Mar 27 14:25:23 EDT 2018 | dph150
Nothing only the first 2 sets of heaters come on and the last 2 sets the middle 4 just sits there and does nothing
Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks
Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Thu Jun 19 12:48:32 EDT 2008 | mumtaz
What the hell our you talking about 200 c max? I would think any nolead part is capable of going hi-er that this. I think you are looking at max temps or something that does not make sents for temps you need to reflow.
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
