Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman
Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can
Electronics Forum | Fri Sep 11 13:57:24 EDT 1998 | Justin Medernach
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Sat Aug 14 20:40:20 EDT 2004 | Grant
Hi, We are currently using the profiler built into our Soltec oven, but are looking for something better and does anyone have any ideas. We want to be able to quickly analyze the profile against solder paste and component profiles so we can quickly
Electronics Forum | Fri Jul 08 04:09:59 EDT 2011 | leadthree
I hope to get some feedback here. I have a SMD connector that reflow-solders quite poorly (I guess solder paste or profile issue). On the X-ray I see strange bubbles, does it mean there are voids under pin? Generally I am not satisfied with the sol
Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian
| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Tue Aug 07 16:12:13 EDT 2001 | Michael Parker
In addition, consider: Solder paste selection, including clean or no-clean is also quite important. This can vary from application and is somewhat process dependant (what works best in the environment). Relow profile. A must for many reasons. And
Electronics Forum | Tue May 26 13:04:08 EDT 1998 | Gary Simbulan
| Recently there was a thread on soldering paladium leads on ICs. A gent from TI suggested an article he had written. Various folks suggested making sure the reflow profile peaked above 215C. | My question is: How does one recognize paladium leads
Electronics Forum | Thu Sep 10 17:57:38 EDT 1998 | Earl Moon
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james
We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell
