Electronics Forum | Wed Oct 20 15:47:14 EDT 1999 | Shane
I am developing a D.O.E for Surface Mount Adhesives and was wondering if anyone out there had any recommendations on a certain brand. I currently have samples of Loctite 3609, 3615, 3618, Heraeus PD955M and MA-420 by Lord Chemicals. I understand Ci
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Mon Mar 30 11:39:46 EDT 2009 | rgduval
Is this a sample board that you ran without components? If so, I'd get it back to your board house, and ask them to explain to you what's happening. We never did get to a satisfactory root cause on our issue (at least, satisfactory to me). It seem
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd
We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a
Electronics Forum | Fri Jun 02 12:18:47 EDT 2006 | Vince Whipple
Marc, Topside temperature is one of the most critical parameters for a successful solder process. Temp stickers are OK to use but won�t tell you the temperature in tight areas. The temp gun like Jay suggested is what I use as a quick indicator. (Rayt
Electronics Forum | Mon Mar 08 19:41:31 EST 2004 | Ken
Robert, what you have provided is not a "profile". It is a "recipe" or "job". I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the asse
Electronics Forum | Wed Mar 12 13:59:54 EDT 2008 | carsan
I am looking for some feedback on the Seica Firefly Laser Soldering System. We saw a demo and were somewhat impressed but would like to hear from anyone that has any practical experience using one. Specifically, we noticed that you have to select t
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
