Electronics Forum | Fri Jun 15 11:05:17 EDT 2007 | grantp
Hi, This is a little embarrassing asking this question, as I think I am profiling our oven incorrectly. I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and
Electronics Forum | Thu Nov 05 09:50:14 EST 2009 | adlsmt
Before you buy a manual screen printer try to do it by hand. We hand stenciled boards with 19mil pitch parts for three years with decent results, with your parts it should be simple. lay the board on a piece of ESD bubblewrap, the kind with small bub
Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon
| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t
Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon
| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using
Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala
Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu
Electronics Forum | Fri Jun 25 09:51:35 EDT 1999 | C.K.
| Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired profilin
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
Electronics Forum | Sun Mar 04 11:15:41 EST 2007 | Jim
>We have looked at a few, and some use the removal time to >>calculate the placement time, which seems like a good idea. The problem with this method is that you can't develop an accurate removal/installation profile. You are removing a component a
