Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Tue Jul 24 08:44:17 EDT 2007 | rgduval
Ron, I'd agree that that sounds high. Some things that may be contributing to it: Volume. lower build quantity often leads to higher placement costs. NRE. Does this website quote an NRE for solder stencils, machine programming, and reflow profili
Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo
Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Sun Apr 25 11:44:14 EDT 1999 | Earl Moon
| | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are usi
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Mon Aug 14 10:35:00 EDT 2000 | C.K.
We've got this power brick device with a Copper casing that gets so hot in the oven, that the solder on the circuit board inside the power brick reflows. Of course, the heat is abosorbed by the case. Profile adjustments have been tried, but we don'
Electronics Forum | Thu Jun 10 14:54:39 EDT 1999 | Jason Gregory
Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like point-to
