Electronics Forum | Fri Jul 08 09:30:35 EDT 2011 | kahrpr
Check that your pick and place machine is not pushing the part too far in the paste and squeezing the paste off the pad. Your profile could need modifying. In the case of the profile the solder paste can slump off the pads before turning into a liqui
Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon
| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u
Electronics Forum | Fri Feb 26 11:48:23 EST 1999 | Cunli
For the Head to show, you have to be a registered individual. Even if you registered your company with SMTnet and are recognized by the posting form on the Forum, you would still need to complete the individual registration process before you have a
Electronics Forum | Fri Feb 26 14:05:28 EST 1999 | Dave F
Cunli: Registration keeps "booting" me back to the start of restration, because the very nice program doesn't accept any type of company. Keep it. Dave F | For the Head to show, you have to be a registered individual. Even if you registered your
Electronics Forum | Sat Dec 03 16:26:40 EST 2005 | grantp
Hi, I have seen demos of these scopes, and don't think they really show you very much. If you profile your board right, and drill up to solder a thermocouple onto the inner balls of the device so you really know your getting a good profile, I don't
Electronics Forum | Wed May 08 04:20:58 EDT 2002 | S.E.J.E
Hi there. I intend to do some evaluation between different pastes, stencils, stencil apertures and reflow profiles (to find practical differences, evaluate stencil suppliers and have some desing guides among other things). I'm considering to use ben
Electronics Forum | Wed Mar 03 23:07:59 EST 2010 | davef
If your "engineer reviewed the reflow profile and said this was not related to reflow conditions," then what does he think it's related to? We think that a increased effort to improve the thermal recipe to solder this part is required, because: * S
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles
Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
