Electronics Forum: doe profile (Page 32 of 64)

BGA faults

Electronics Forum | Thu Aug 17 05:56:39 EDT 2000 | Jacqueline

Hi Folks, Hope yous can help. I'm having a problem when reworking (placing) 40mil BGAs. One side seems to be collapsing more so that the other, resulting in the outer row of balls not properly reflowing and making the connection. This is only happeni

Vectra Wave

Electronics Forum | Tue May 02 17:11:17 EDT 2000 | John

My company just purchased a Vecta (E-vert) wave soldering machine. Bridging has become a serious issue, both on SMT components and thru hole. We are currently seeing about 500 ppm. The products that are being run now were run previously on our old

Liquid, Dispensable Solder Mask

Electronics Forum | Mon Mar 20 15:48:52 EST 2000 | Shane Lay

We are planning on converting to a no-clean soldering chemistry and will need to replace our water soluble liquid solder mask as a result. Does anyone know of a dispensable, "peelable" solder mask I can evaluate? It would be nice to find one that i

orange peel effect on solder joints

Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby

Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea

Process Qualification

Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig

I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1

Test vehicle for PWA cleaning

Electronics Forum | Tue Jun 26 09:37:28 EDT 2001 | Steve Vargas

We are interested in doing some further studies on our cleaning process, particularly with respect to how well we can clean underneath low profile components. As an SMT subcontractor, we'd ideally like to qualify our chemistry/cleaning process to cer

Re: BGA Rework

Electronics Forum | Wed Jun 09 14:51:08 EDT 1999 | Earl Moon

| Does anyone have thoughts on BGA rework. We now use the OK BGA 3000 and now am considering an Infrared machine. Any thoughts? | I've used Pace, Conceptronic and, now, SRT machines. Bottom side IR is OK. Better thermal balance is achieved with hot

Solder Balls

Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa

Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde

Re: Slim-Kic prophet system

Electronics Forum | Wed May 27 15:50:04 EDT 1998 | Rick

The KIC Prophet system does indeed deliver as promised. The Slim-KIC (datalogger portion) works well and is worth the price of admission by itself. The Prophet portion of the system (resident in the oven) works great and decreases the requirement for

Open joints

Electronics Forum | Wed Oct 03 09:56:51 EDT 2001 | Claude Tremblay

Hello everyone We have a QFP-308 (0.20" pitch)on a board and we have a lot of opens after reflow. We checked our profil by installing thermocouples on the pads of the component and everythings seems OK. We checked the coplanarity of the leads and it


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