Electronics Forum | Sat Dec 03 16:32:47 EST 2005 | grantp
Hi, I found one of the best features of profiling software was if the software can do the analysis of the profile for you and tell you how far out of the process window you are, and let you simulate oven temperatures and then give you a best guess o
Electronics Forum | Fri Jan 18 09:35:49 EST 2013 | dyoungquist
Just because a certain profile works good for a board with a BGA does not mean it is automatically the correct profile to use for a different board that contains an LGA. Have you run a separate profile check with the board containing the LGA?
Electronics Forum | Tue Dec 17 08:55:52 EST 2002 | Randy Villeneuve
Grant, The board maybe the problem but how is your oven working? Is it a convection oven and how many zones (top and bottom)? What does your profile look like? If you are unsure and if you only have one oven, send your board to Soltec or Electrovert
Electronics Forum | Tue Aug 10 11:44:20 EDT 1999 | John Thorup
| Does anyone use reflow profilers? Are they a good investement or is trial and error sufficient? | | Does anyone have any suggestions on profiles to try? Thanks. | Danielm I would hazard a guess that most if not all of us production folk do. I c
Electronics Forum | Fri Jun 27 12:27:37 EDT 2003 | russ
We basically have 5-6 recipes for each oven based on mass etc... However if you like to have a quickfire way to ensure that the correct profile is running (like in a process audit) It is nice to see that the board and profile number match. (Running b
Electronics Forum | Thu Aug 22 05:27:42 EDT 2002 | zolasteven
Hi, With regards to reflow oven or furnace, when conducting a temperature profile how does one determine how many points(Parts) on the pcboard to be measured/connected to the temperature profile. And how to determine what parts to measure? Than
Electronics Forum | Mon Dec 24 19:12:06 EST 2007 | adamben10
I'm shadowing an old posting posted by Odor back in March 2002. Any Expert out there, if you have good answer to the below questions, please dive in...Thanks in advance. 1) Does anybody have done the profiling board life time experiment? 2) The prof
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
