Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Tue May 26 20:24:39 EDT 1998 | Dave F
| Does anybody know a (if possible low-cost) system | which can travel with the PWBs through a reflov oven | (like some temperature profile loggers) for measuring | the residual oxygen? My problem is, it is a batch oven | which does not allow to h
Electronics Forum | Tue Apr 25 21:29:08 EDT 2006 | TMC
Thanks for all the replies. Rob . . . that's what I was looking to get feedback on; to see if others can program their reflow ovens so that double sided boards only reflow on top during the second pass. Our oven does have an edge belt conveyer so t
Electronics Forum | Fri Nov 05 17:17:32 EST 1999 | NickMata
Fred, The system will base itself on the information within the GF file. In the GF file you provide the description as to the physical dimensions, features, tolerances and handling for the part. Once the component has picked up the image, it is "see
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Wed Aug 27 14:41:49 EDT 2003 | Stephen
Have you checked the temperature profile at the balls? Just because a recipe works "fine most of the time" does not mean it is optimum. Do you have a machine that can measure co-planarity? If I get time I plan on using the MPA to look at co-plana
