Electronics Forum: doe profile (Page 40 of 64)

Re: Controlled TempHumidity rooms

Electronics Forum | Wed Dec 09 14:36:26 EST 1998 | Earl Moon

| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 14:48:12 EDT 1998 | Chrys

| | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | Example: | | Screen Print = 45% of total defects | | Component Placement = 25% of total defects |

Reflow Oven Calibration

Electronics Forum | Tue Mar 05 20:00:47 EST 2002 | rwilliams

I have recently been handed all responsibility of our Reflow Ovens. Upon my inspection, I discovered that any possible device on the ovens that you would think would require calibration, has a sticker indicating no calibration required. The practice

solder ball

Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ

Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A

BGA rework stencils ( down to 0.65mm pitch)

Electronics Forum | Mon Oct 14 17:28:08 EDT 2002 | msimkin

Russ, Thanks for the feedback. Yeh, we are placing them in production using a full ball detect Yamaha placement machine, 5 thou square stencil. etc.etc. The only reason I raised this concern was from a rework point of veiw (actually, the board desi

What is this?

Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas

What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,

Epoxied Parts Falling Off

Electronics Forum | Thu Feb 20 10:56:49 EST 2003 | larryk

Interesting topic, I got a side bar question. The epoxy companies suggest a lower consistant temp (something like 1 minute at 160 degrees) for curing. But we epoxy and paste our boards that get waved. (I know, why are ya pasting a board that goes t

Wave soldering profiling

Electronics Forum | Thu May 06 19:56:30 EDT 2004 | bruceatknoll

Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOL

CLEANING OXIDIZATION OFF OF WHITE TIN PADS

Electronics Forum | Fri Jul 18 10:23:06 EDT 2003 | James

The parts adhere solder very well. It does not pertain to a certain part on the board either it is all over the board. I cant really say that it is oxidization all you can tell is that on certain parts of the pad still shows like white tin and that

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa


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