Electronics Forum: doe profile (Page 9 of 64)

1B73LOC Conformal Coating

Electronics Forum | Mon Jun 25 10:59:49 EDT 2007 | simsj

We're using the 1B73LOC conformal coating from Humiseal. We've seen some bubbling of the coating. Their tech handbook suggested reducing our oven ramp speed. Does anyone have a good profile for this? They've always pointed me to Nordson, and Nord

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny

I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel

REFLOW PROFILE NEED HELP

Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii

I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo

solder balls

Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker

Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a

Water soluble solder mask for reflow soldering.

Electronics Forum | Thu Oct 17 00:34:59 EDT 2019 | jani

Hi, We have solder reflow use with water soluble flux and Tin/lead process. There is special glass component which needs to mask during reflow soldering and wash flux+solder mask post soldering. The existing solder mask does washes off. But leaves

Re: FR4 vs Polymide

Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon

| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr

The story so far!

Electronics Forum | Mon Dec 04 11:28:44 EST 2006 | samir

Patrick, Have you seen Al Gore's documentary on Global Warming, "The Inconvenient Truth?" It was okay, but I didn't like how Gore got political in a few scenes by slamming the current administration's environmental policies (or lack thereof...c'mo

Reflow Profiling

Electronics Forum | Thu Oct 28 05:35:49 EDT 2004 | rlackey

Dave, I think you'll find you'll score higher if you add a cheeky half twist - you'll get a higher difficulty multiplier on your final score. Profiling is highly dependant on the quality of your oven, number of zones, temperature profiling tools et

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo

Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so

What are the best profiles for 3 zone ersa reflow?

Electronics Forum | Fri Mar 27 12:44:07 EDT 2009 | stepheniii

Let me be the first to suggest; Get a better oven. 5 zones minimum. If you can't, you will have to have some way of profiling the board. Does the oven have thermocouple ports? If not you will have to buy some kind of termperature datalogger. Mayb


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