Electronics Forum | Mon May 24 15:50:11 EDT 2004 | Rob
hi all What do you think about soldering pb-free in reflow oven (air) lenght 1,7m (5 zones top,bottom) with max zone temp. 300C? Do you think that this process will be stable? Our max PCb dimension 260x260 mm. When i compare different oven producer t
Electronics Forum | Wed Sep 17 04:15:23 EDT 2003 | C Miller
The magnetic thing from the sot23 thread made me think of somthing from the past. Does anyone have any experience with vibrating boards during reflow? I know for a fact that if you vibrate a board during reflow it will alow the parts to "float" and
Electronics Forum | Tue Oct 09 11:52:41 EDT 2001 | vance
does EFD have a website? -vance
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Tue Oct 07 13:01:48 EDT 2014 | charliedci
does anyone have experience with reflow of Micro SD cards to PCB@ lead free temps?
Electronics Forum | Wed May 15 09:46:15 EDT 2002 | davef
Francois: How much moisture does a typical reflow cycle remove from popular SMT packages?
Electronics Forum | Tue Apr 07 22:34:14 EDT 2009 | 1036
Board delaminated after reflow - see attached picture. Does moisture cause this problem?
Electronics Forum | Tue Jan 25 11:40:48 EST 2011 | atiya124
Does anyone know How is Tamura Reflow Ovens? All the feed backs are appreciated.
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Tue Sep 22 08:35:47 EDT 2009 | cman
Did you try pre-tinning your board on this suspect pad/s to see if it improved wetting/solderability prior to printing/SMT placement and reflow? Does the pad/s not soldering tie to a ground layer? I would connect a T/C to each pad of the same part an
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