Electronics Forum | Thu Oct 01 18:06:27 EDT 2020 | proceng1
We are looking to underfill a small QFN and have never done this before. I have read the data sheet, but I have specific questions. Does anyone have experience using Loctite Eccobond 1216M?
Electronics Forum | Wed Dec 12 08:42:35 EST 2001 | jmathis
Hello, The problem is we are using loctite 3609 in the 300ml syringe and loctite only sells this by the case (10 cart). Our company can not use this quantity before expiration. Does anyone have any recommendations for a smt adhesive that can be pu
Electronics Forum | Tue Aug 31 11:29:16 EDT 2004 | Danish
Do anyone know the difference between Loctite 315 and 384? What does it means by Repairable adhesive?
Electronics Forum | Mon Apr 27 07:37:42 EDT 1998 | Scott Davies
| | I realize this is a SMT forum, but I have another | | problem related to electronics assembly and hope there | | will be someone out there that can save my life (this | | time). | | We build quite a few VME assemblies to which we attach | | a SA
Electronics Forum | Wed Jan 03 05:21:01 EST 2001 | David T Truman
We currently use Multicore solder cream and I have recently been made aware of possible unrest in the Multicore/Loctite camp. Does anyone know what the future holds for Multicore and is it true that they may be pulling out
Electronics Forum | Tue Oct 24 17:31:57 EDT 2006 | SWAG
We have a SMT part that has been adhered to a board using Loctite 3609. I can't find anything in the product specs. on how to release the bond to remove the part. Does anyone know?
Electronics Forum | Fri Oct 02 06:39:36 EDT 2020 | SMTA-64386317
I am using Bonotek 3400UF and Hysol for underfill application. What is your challenge on underfill process.
Electronics Forum | Mon Oct 05 01:20:46 EDT 2020 | SMTA-64386317
No pre heat the board and only apply at 2 sided of component. Yes, there is bleeding but as long did not covered nearby component is acceptable. We are using UV oven for curing.
Electronics Forum | Mon Oct 05 11:51:30 EDT 2020 | proceng1
Our application has a ground pad underneath. So I'm not sure if applying on two sides will work.
Electronics Forum | Fri Oct 02 11:02:24 EDT 2020 | proceng1
Do you preheat the board? Do you apply on two sides and let it fill under, or along all 4 sides? Does it bleed away from the part as well, or does it wick under the part during reflow? Basically, we've never used underfill before. So I don't know
