Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie
I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi
Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch
I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
Electronics Forum | Tue Sep 19 00:35:54 EDT 2006 | darby
Fred, We receive ENIG pcbs in vac-formed bubble wrap with ,of all things, polstyrene packing! Despite my long-lasting complaints nothing has changed. BUT - I have never really had a problem with any of these PCBS. There are no moisture, salt or any o
Electronics Forum | Tue Sep 12 15:02:39 EDT 2006 | Fred
We are being pushed to use seaborne shipping containers as the method to receive PCB�s from fab houses in China. Time on the ocean will be several days to a few weeks depending on how slow the boat is. Does anyone have any suggestions on packaging
Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
