Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Sat Oct 10 04:58:18 EDT 1998 | Tony B
| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Mon Feb 16 16:28:25 EST 1998 | Brian Stumm
Dear Brian, I came across your question on the SMT Net and thought I better reply to this one. Perhaps you might remember me. My name is Brian Stumm and I work for ETS, Energy Technology Systems. I believe we met in Anaheim, CA during last years Nepc
Electronics Forum | Mon Jun 18 10:11:52 EDT 2007 | dyoungquist
Almost every board/panel we build is double sided and we use an MPM SPM screen printer with no problems. The screen printer is not the cause. We have seen heavier parts fall off the first side when going through the reflow for the second side. We
Electronics Forum | Thu Mar 20 09:40:33 EST 2003 | russ
Are you warping the BGA or the PCB? Russ
Electronics Forum | Wed Nov 21 04:08:12 EST 2007 | aj
Thanks guys. Chunks - how many zones do you have in your oven ?
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
