Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan
| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of
Electronics Forum | Wed Apr 06 11:54:24 EDT 2005 | Indy
did you try using double header connector pin of a different lot? Indy
Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel
Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t
Electronics Forum | Thu Jul 20 16:56:39 EDT 2000 | lkoens1
Bob, Tell us more about this assembly concept
Electronics Forum | Wed Apr 06 12:36:53 EDT 2005 | smt_rookie
I've tried a different lot of the same double header connector (yes its double level right angled header conector) twice but nothing has improved. I've also suspected that top row of the connector has greater heat sinking capacity (which should hold
Electronics Forum | Mon Apr 25 05:37:35 EDT 2005 | Bryan
Some weeks has passed,Can SMT eng. show us your results of this issue?so that we can learn something from it
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Mon Aug 19 15:42:27 EDT 2002 | loquetis
Is there any significant difference in the time required (average) to reflow a BGA component versus replacing the component? My company is attempting to determine the time to break-even for capital investment in a BGA workstation.
Electronics Forum | Wed Apr 06 15:28:04 EDT 2005 | patrickbruneel
Soldering PTH in reflow makes the process a lot more dependent on the physical forces in soldering (capillary force vs. gravity). Reducing the topheat in your oven will help the capillary forces (opening the hood solved the problem). Heat rises so if
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
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