Electronics Forum: double reflow bga (Page 5 of 198)

Re: bga

Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon

| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine

Re: bga

Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY

| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac

bga warp

Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske

Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located

bga reflow in water clean solder

Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef

We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia

bga reflow in water clean solder

Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal

Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water

cost effective bga remove

Electronics Forum | Tue Mar 09 17:41:24 EST 2004 | davef

Try this: * Run the board through your reflow oven set for a "normal" recipe, but with the cooling section turned off. * Pick the BGA from the board while the solder is still liquid using tweezers [or similar tool].

underfilling of bga

Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo

Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar

mirco bga stencil opening

Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton

I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee

cost effective bga remove

Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper

Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac


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