Electronics Forum | Mon Mar 22 09:37:28 EST 2004 | ellis
After 2nd time reflow of double reflow, wrinkles solder joints found on SOIC and SOT components.(only happen on the components at the underside of pcb during reflow, top side components dont have this problem) is this due to the reflow process proble
Electronics Forum | Mon Mar 22 10:24:03 EST 2004 | davef
Wrinkled like orange peel?
Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov
Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w
Electronics Forum | Tue Jul 18 17:47:02 EDT 2000 | bluto
What kind of ict nail should we use when testing a board that does not go through wave solder? There is no dome shape for our nails to "bite" into, and we are having problems.
Electronics Forum | Tue Jul 18 20:17:25 EDT 2000 | Dave F
Bluto: Either: * Give the springs in your probes some spinach ... OR * Print some paste onto your test pads Popeye
Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel
The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching
Electronics Forum | Fri Feb 23 15:31:31 EST 2007 | realchunks
Running the BGA first is OK. We run double sided BGA baords all the time without problem.
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Fri Mar 02 17:56:17 EST 2007 | davef
Samir's correct. We've talked about this previously. Search the fine SMTnet Archives for those discussions, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=23236
Electronics Forum | Thu Mar 01 00:27:58 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
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