Electronics Forum | Thu May 23 09:25:39 EDT 2013 | cyber_wolf
How many of you run a different oven recipe for the secondary side of a double sided reflow assembly. In other words, would you use the same recipe for both sides ?
Electronics Forum | Thu May 23 10:29:15 EDT 2013 | emeto
We would usually have the bottom zones at the reflow with 10 degrees less than the top ones for the secondary side. This we proved helps to keep the parts of the primary side on the board.
Electronics Forum | Mon Oct 04 04:01:10 EDT 1999 | Chris May
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Fri May 24 09:48:02 EDT 2013 | emeto
What you are saying is very interesting and it would be great if you later post this formula.
Electronics Forum | Tue Oct 05 03:49:04 EDT 1999 | Chris May
| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000
Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller
Electronics Forum | Thu May 23 11:57:21 EDT 2013 | dyoungquist
We run the same profile for both sides. We also run the bottom temp 10C cooler in the final 2 heat zones.
Electronics Forum | Fri May 24 14:42:35 EDT 2013 | dilogic
Google for this: "weight_limit_qfn_smta.pdf" Although it is focused on QFN, formula can be used for most parts...
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
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