Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Tue Sep 04 11:26:12 EDT 2001 | Jean Michel
During the solderin of a double side board, how can I calculate the maximum weight of a component I can put in the first side to avoid the component fall down in the oven (depending on the soler join surface) ? Are there some rules ?
Electronics Forum | Thu May 16 15:37:45 EDT 2002 | Hussman69
I fit you in where you work!
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue Sep 04 18:11:18 EDT 2001 | davef
Assuming you're asking about double sided reflow soldering ... Use pad mating to lead wetting area. Bob Willis has found the ratio to be as much as 44 grams/sq in. Check Bob's site [Electronic Presentation Sevices] for more. Phil Zarro uses the
Electronics Forum | Fri Sep 07 09:19:44 EDT 2001 | Hussman
Jean, A lot depends on your process. can you add a dot of adhesive after screen printing and before placement? This works well for larger heavier parts. A second suggeestion is to reprofile your board. Try keeping the bottom side cooler. I do t
Electronics Forum | Mon Sep 10 11:10:30 EDT 2001 | jmlasserre
Dave, Thanks for your quick answer, I read some paper on the forum. I would like to learn more and to know how to obtain the result of x gr / sq in (mathematic methode). Do you know where can I found it ? Thanks. J Michel
Electronics Forum | Wed May 08 09:40:33 EDT 2002 | Hussman69
One thing most over look is the time between the last reflow and the second print. You don't want to print on a hot board.
Electronics Forum | Wed May 15 09:46:15 EDT 2002 | davef
Francois: How much moisture does a typical reflow cycle remove from popular SMT packages?
Electronics Forum | Wed May 15 21:45:31 EDT 2002 | ianchan
Hi mates, any production floor controls that are efficient and effective? to control MSD. am talking about practical shopfloor "good mfg practices".