Electronics Forum | Fri Jun 23 09:53:40 EDT 2000 | Bob Willis
Also I suggest you read through the Charity Report I produced on the specifi process of Double Sided Reflow Assembly which you can also get from the SMTA. All the money from the sale of the report goes to the Charles Hutchins Scholarship Fund which T
Electronics Forum | Fri Jun 23 10:29:51 EDT 2000 | Bob Willis
Also I suggest you read through the Charity Report I produced on the specifi process of Double Sided Reflow Assembly which you can also get from the SMTA. All the money from the sale of the report goes to the Charles Hutchins Scholarship Fund which T
Electronics Forum | Thu Jan 20 20:22:16 EST 2000 | Sam Guilaume
We have run some experiments on double side BGA assembly. Our preliminary results show that complete overlap of top and bottom BGA's indicate fair results, even after reliabiltiy tests (vibrations, temperature cycles, HALT). I will be interested to h
Electronics Forum | Fri Dec 22 17:25:00 EST 2000 | Dave F
I'd bet money our operators could use the wrong paste at the wrong time with out the slightest hesitance. This seems to be a fairly novel approach to making things complicated. I will admit I've heard of people talking about doing this, but I must
Electronics Forum | Tue Dec 26 15:22:43 EST 2000 | Hussman
Vickij, Why not try using regular temp. paste for both sides? Unless you have some real heavy parts on both sides, you can run a double-sided reflow process with most boards. I myself like to place R's and C's first (or bottom side) and then do an
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
Electronics Forum | Mon Aug 17 19:37:25 EDT 2009 | hegemon
And of course the obvious, you'll want to be running that second side on the rail, and not the belt. Yeah, yeah, too obvious, I know... but don't say no one said so! 'Hege
Electronics Forum | Thu Aug 13 03:41:30 EDT 2009 | robhs
At risk of raising a topic that has already been discussed at length, if that is the case then please point me in the right direction. We have a Lead-Free assembly that has BGA devices on both sides of the board. Any recommendations as to how we mig
Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette
Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will
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