Electronics Forum | Mon Feb 03 20:23:48 EST 2003 | davef
Use the pad mating to lead wetting area. Check: * Phil Zarrow's site [ http://www.itmconsulting.org ] for a paper. * Bob Willis may have something on his site [ http://www.bobwillis.co.uk ]. He has been very involved in developing this measure. * F
Electronics Forum | Thu Jun 22 11:01:54 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Jun 22 11:02:13 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Fri Mar 02 17:56:17 EST 2007 | davef
Samir's correct. We've talked about this previously. Search the fine SMTnet Archives for those discussions, like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=23236
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Mon Sep 29 14:47:15 EDT 2008 | davef
Let's narrow this down. Questions are: * Are you putting the proper amount of solder in the board with your stencil print process? * If you are putting the proper amount of solder in the board, where is the solder going? Pick one and then fill-in th
Electronics Forum | Tue Jul 24 10:29:10 EDT 2007 | ed_faranda
Is there a reason why you want to wash the board before wave?!?!? What is your process flow? I run bottom side of my boards first, then top just to make it easier to setup (easier to put those support pins around those smaller components). But,
Electronics Forum | Tue Jul 24 08:41:16 EDT 2007 | babe7362000
Does anyone out there run the adhesive side first and then the solder side and wash? I was just wondering if this is a good practice or not. I am afraid that we will lose some of the parts, that are just glued on, in the washer? Basically I am try
Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip
Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa
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