Electronics Forum: down bonding (Page 1 of 5)

Connector is falling down in the second reflow

Electronics Forum | Wed Feb 12 02:38:02 EST 2020 | majdi4

Hi there , I agree with phil .. but we cannot change the architecture of the card to mount the connector on the 2nd side. Steve , we are producing large series, so we can't manually ship bond the connector .. for the moment, we cannot invest in a gl

wirebonding

Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean

Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de

Au Plating

Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef

First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi

Ultrasonic washing for boards

Electronics Forum | Wed Apr 27 23:23:18 EDT 2005 | pdeuel

It was a resonant frequency that brought down the Narrows bridge. Memorex can shatter a wine glass with resonance. Ultrasonic washers use frequency to do what they do. If anything on the pcb has a length width or mass that resonates at the washers fr

BGA inspection microscope

Electronics Forum | Fri Dec 02 07:53:25 EST 2005 | solderiron

Get a demonstration, on most packages these systems can see down a row. You don't see solder flux residue with X-Ray. You don't see the intermettalic bond with x-ray. They are some what expensive but together with X-ray you have an excellent quality

Mechanical Delamination at de-panel

Electronics Forum | Thu Jun 12 12:35:52 EDT 2014 | clydestrum

I didn't even think of running a blade down those scores. I will give it a shot and see. The laminate they're using is Nanya NP-140, if anyone has ever used it or has any info regarding it's issues around something like this. We can see resin weave

SMT REWORKING ( BGA )

Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve

The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-

Re: Conductive Epoxy

Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez

| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Thu Feb 22 09:56:21 EST 2001 | blnorman

An adhesive, is an adhesive, is an adhesive. Yes most will thin when exposed to elevated temperature, but that's only for a short time. As cross-linking starts, viscosity increases. Having made countless numbers of adhesively bonded samples in the

  1 2 3 4 5 Next

down bonding searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Training online, at your facility, or at one of our worldwide training centers"
Electronics Equipment Consignment

Software for SMT placement & AOI - Free Download.
pressure curing ovens

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
2024 Eptac IPC Certification Training Schedule

Reflow Soldering 101 Training Course
Assembly Automation Technology

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India