Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Tue Dec 05 10:35:39 EST 2000 | Gil Zweig
See IPC-7095, "Design and Assembly Process Implementation for BGAs"
Electronics Forum | Wed Feb 02 19:45:09 EST 2005 | ybt
try refering IPC-7095 Design and Assembly Process Implementatin for BGAs. I hope it helps.
Electronics Forum | Mon Jun 18 11:36:37 EDT 2001 | Gil Zweig
Guidelines for the use of x-ray inspection for BGA can be found in IPC Stadard 7095.
Electronics Forum | Mon Jun 18 11:41:20 EDT 2001 | Gil Zweig
Guidelines for the use of x-ray inspection for BGA can be found in IPC Stadard 7095.
Electronics Forum | Thu Jan 24 22:59:06 EST 2008 | dragonslong
Hey....is there really no people who can advise me?
Electronics Forum | Sun Aug 10 21:57:25 EDT 2014 | cmchoue
Does IPC definition for "QFN Void Ration" ? Like IPC 7095 susgestion the BGA Void ratio.
Electronics Forum | Thu Dec 07 11:28:49 EST 2000 | Dason C
I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason
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