Electronics Forum | Thu Jan 18 19:16:42 EST 2001 | slowe
I am having problems with D-Packs shifting during reflow. Does anyone know of a good aperture design to solve this problem ? Possibly bow tie.
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Fri Feb 02 12:37:11 EST 2007 | kennyg
For pads such as a d-pack... what is the effect on heat dissipation of leaving the unsoldered portion of the pad exposed metal or covering with solder mask? Is there a percentage of heat dissipation that is inhibited by covering with mask?
Electronics Forum | Wed May 31 07:55:55 EDT 2017 | buckcho
In IPC it is said that the void % should be established between you and the customer. There is no number. There is only requirement for balls on BGA. I have a customer that agreed to 40% on D-packs which is okay for both us and them.
Electronics Forum | Mon May 19 14:29:27 EDT 2014 | wendynguyen234
We have a Samsung CP20 with window 95, S-2000 MMI version 1.27 from Manncorp Inc. that freeze on window 95 screen. It was found that the mother board was at fault & need to be replaced. We replaced it with a compatible one & kept the original hard dr
Electronics Forum | Mon Jan 19 05:02:07 EST 2015 | gertjannus
I've some troubles with LGAs components. i try to create void free results. so far i have no problems with dpacks, i think i do something wrong with the vacuum time. The padcoverage of my lga is very bad the vacuum creates solderballs under the compo
Electronics Forum | Thu May 17 03:23:44 EDT 2018 | shuhaib
the D-PACK IC are falling down in primary side while second side reflow soldering. the solder paste volume is ok. reflow time ( TAL ) is less than primary side. but still issue is happening. let me konw how to prove it is DFM issue, because its hea
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
