Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
Electronics Forum | Fri Aug 10 06:40:20 EDT 2012 | thmeier
The unique heat on the PCB is the big advantage and you also can´t exceed the temperature of the boiling point of your medium (we use a 240°C Galden). So small components are not "overheated" until the bigger ones like DPAKS are soldered. You also ne
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky
Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Tue Mar 06 19:45:52 EST 2007 | davef
DPAK align on the tab with leaded solders. They don't align much with unleaded solders, but we know that your Indium NC-SMQ 92J is leaded. So, there may be too much paste on the heat sink tab causing the component to float [or wim] during reflow. If
Electronics Forum | Mon Apr 14 16:21:58 EDT 2008 | ck_the_flip
Bottom-side SMT parts CAN and DO go liquidus during the 2nd reflow cycle. It could be that there was enough variability between the 2 different lot code PCBs to cause the parts to fall off. Remember wetting force determines surface tension (the abi
