Electronics Forum | Thu Jul 20 17:03:04 EDT 2000 | Bob Willis
Yes this is the draft plan in Europe 2008. Bob
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Thu Jan 11 18:21:07 EST 2007 | SWAG
We shipped one to Canada (draft dodger).
Electronics Forum | Thu Jul 20 16:32:01 EDT 2000 | Bob Willis
I guess you are refering to lead free solders. If you read through the draft directive the plans are defined but not who will do the monitoring. Some companies do have the ability to do this sort of task but not all. The latest documents are availab
Electronics Forum | Mon Jan 23 20:58:08 EST 2006 | davef
J-STD-003B - Solderability Tests for Printed Boards is currently a "Working Draft". Look here: http://www.ipc.org/status.asp
Electronics Forum | Fri Jan 18 15:00:03 EST 2008 | patrickbruneel
European rocket science!!!! A 189 page report to conclude that if you ban something you will use less of it. http://ec.europa.eu/enterprise/environment/reports_studies/studies/draft_rep_study_rohs_directive_dec07.pdf
Electronics Forum | Wed Sep 01 01:47:43 EDT 2010 | markhoch
Sheesh Mike. Can I get you to do my homework too? I've got a term paper coming up on Forcasting Advancements in Artificial Intelligence. Due in two weeks. Let me know when you've got a rough draft I can critique. ;)
Electronics Forum | Fri Dec 05 10:09:36 EST 2014 | robl
Hi Rob, Could be moisture getting into the boards or the BGAs or it could be drafts messing with the thermocouples measuring the heat at board level meaning you over cook it. Are you pre-baking the PCBAs & the BGAs before reworking and replacing?
Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef
If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components
