Electronics Forum: dross adhesion (Page 1 of 1)

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 17:53:32 EDT 2000 | Dave F

John: I�m here. On "what do ya think about that one!..."??? Mutha, that sounds rat�s rump [as Dennis Miller says] ugly. On some boards, we paste a cuppla chips on the break-away panels and then torque the chips from the board after cure. We use the

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian

Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 12:27:21 EDT 1999 | Earl Moon

| | | Dave, I'll respond by paragraph: | | | | | Brian: | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian

| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon

| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like

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