Electronics Forum: dross adhesion to (Page 1 of 9)

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 15:09:36 EDT 2003 | davef

Matt: What are we looking at in pix F2?

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:05:46 EDT 2003 | davef

Sorry Matt. I mean the last row, second picture in from the left.

adhesion of copper to solder mask

Electronics Forum | Thu May 28 22:12:18 EDT 2009 | davef

If your newer board passes a tape test, you should be OK.

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:18:51 EDT 2003 | Matt Kehoe

Hi Russ, Thanks for the input. The squeeze out we are reworking is very very thin since it has been flattened so it is actually easier to remove than usual but I agree, with a pad this small it could exert a bit of stress on the bond line if rework

adhesion of copper to solder mask

Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito

Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 05:28:35 EDT 2003 | matt kehoe

Photo's can be found at http://www.sipad.com/ssi_qa/smta/microbga.htm mk

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 15:56:14 EDT 2003 | Matt Kehoe

Hi Dave, Hmmm, pix F2? Do you meran figure 2 or second picture? The second picture is the bare board before printing. Gold plated pads. Is that what you mean? mk

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:12:01 EDT 2003 | Matt Kehoe

Right-o Dave, Thats the 2 lifted pads turned upside down so actually you are looking at the bottom of the base copper where it used to be attached to the laminate. mk

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe

Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ

Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask

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