Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Thu Jun 10 16:58:40 EDT 2010 | daxman
I've worked at several companies that have used Smart Sonic ultrasonic cleaners. About a year ago, we purchased the Smart Sonic 1550 and Enviroguard. The Enviroguard produces DI water for rinsing and also handles the solder waste. Also, Smart Sonic h
Electronics Forum | Mon Dec 09 21:00:39 EST 2019 | sssamw
Did you solve this issue? It doesn't much look like the flux dried out, ti should be across whole board and has much more same defect if flux dried out. Did you have failure ratio data to show the defect location, for example 10% at location A on bo
Electronics Forum | Fri Oct 29 17:44:13 EDT 2004 | davidcb
Davef, thanks for inputs. I think your correct, we have since obtained some ionic analysis and sure enough there is relatively high chlorides on the bare pcbs. The toluene is controlled within dip tank / drying system, almost no exposure to workers.
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun
The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Wed Oct 11 10:29:28 EDT 2000 | G. English
Try the following steps : FIRST CHECK THE ARCHIVE for further information, it WILL help you. Step One : What�s the chemical analysis of this white res? Obtain a sample. It could be tin, rosin, or something else??? Step Two : The fastest way I know
