Electronics Forum | Mon Aug 12 19:35:42 EDT 2002 | sleech
Been there, ... done that,...got the T-shirt. When with a major IC manufacturer, we tried this. IT DIDN'T WORK! The problem was that most convection ovens leak. We could not achieve a significant N2 atmosphere.Eventually went to vacuum-assisted bak
Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM
Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at
Electronics Forum | Wed Aug 07 09:05:11 EDT 2002 | davef
N2 PPM vs %RH? With a firm grasp of the obvious, reflow oven manufacturers rig N2 ovens differently than non-N2 ovens. The N2 displaces O2. Usually N2 oven monitor something or other to give an indication of N2 ppm. %RH really isn't part of the eq
Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike
I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a
Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech
Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm
Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno
http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Wed Feb 15 09:00:46 EST 2006 | GS
if you look at the J-STD-033B, you will see that such a large PQFP could stay even longer the 24h at 125�C even if internally is already totally dry. It could be, the balls can get oxided and also IMC (Inter metallic compounds) could grow avery littl
Electronics Forum | Mon Dec 31 05:14:58 EST 2001 | ronih
Hello, Are there any rules for PCB drying (baking) before assembly; Date code criteria, finish process on PCB, storage conditions.. ect. I know some assemblers that are baking all PCB (not ENTEK!) as default before assembly, is it realy nessesary? i
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
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