Electronics Forum | Fri Sep 28 00:50:40 EDT 2018 | benny
How much is the exposure tolerance for PCB auto dry film?
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Sat Sep 29 04:55:49 EDT 2018 | sanneyyu
for pattern position with +/-2mil tolerance, pattern width may minus 0.5mil max with the traditional auto exposure.etching tolerance determined by the base copper foil.
Electronics Forum | Thu May 06 18:31:29 EDT 2004 | Dreamsniper
"Polymide Films absorb a great deal of moisture. Polymide laminates must be baked at more than 1 hour at 100'C or better for a double sided PWB prior to exposing the laminate to elevated temperatures such as that required for soldering. Moisture abso
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Thu May 31 10:12:22 EDT 2012 | edmaya33
Positector for dry film.
Electronics Forum | Wed Jun 13 17:15:48 EDT 2001 | medernach
Yes, I've seen it recently and it's most likely a component problem. A cap is essentially a sandwich comprised of multiple layers. the layers are either wet film or dry film. The end terminals may either be hot soldered or sputtered so there are a
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
