Electronics Forum | Thu Nov 11 00:59:42 EST 1999 | Charley Qin
Hi, TOM Did you check your oven's chain movement? Is it stable? Good luck.
Electronics Forum | Mon Feb 13 13:43:54 EST 2006 | pjc
You will begin to de-wet at a high TAL and actually likely see all of the conditions you list.
Electronics Forum | Tue Nov 09 20:16:31 EST 1999 | Thomas
10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?
Electronics Forum | Tue Jan 06 21:19:05 EST 1998 | Dominic Nguyen
We use no clean paste and sometimes experience flux splattering which gives spot on gold fingers. Need help in analize the cause. thx.
Electronics Forum | Tue Feb 07 16:45:32 EST 2006 | Mike
Can someone point out what sort of defects at the joint I can expect if solder is above liquidus for 3-4 minutes rather than the typical 1 - 1.5 minutes. Voids? Grainy joints? Poor wetting? Thanks
Electronics Forum | Tue Feb 07 17:47:30 EST 2006 | grantp
Hi, I would say the most worrying defect would be damaged parts due to exceeding their temp specifications. Regards, Grant
Electronics Forum | Tue Feb 07 19:10:04 EST 2006 | GS
Hi, other effect could be the extra inter-metallic thickness that could compromise the solder joint reliability. just my 0.00001 Doblon Best regards.........GS
Electronics Forum | Fri Feb 10 15:19:28 EST 2006 | Chunks
Wow, how people get off track. You'll probably see OK joints, but the flux will be burt. Your boards will prob. discolor and possibly delaminate. Some of your parts amy discolor too. Depending on your paste, you will probably see some balling/bea
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
