Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef
It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
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