Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Electronics Forum | Wed Feb 06 22:27:05 EST 2008 | davef
While you're waiting for others to reply, read a previous posting here on SMTnet http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Thu Feb 07 22:57:29 EST 2008 | davef
The link to the IVF paper referenced in the link above seems to broken. Here's another link to it http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=363
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Electronics Forum | shellydhami |
Sat Jul 05 14:04:31 EDT 2008
Electronics Forum | Wed Oct 23 05:02:38 EDT 2002 | nifhail
Guys what is the diff. between Dye Pry test vs cross sectioning, and how is it done ? Thank you..
Electronics Forum | Wed Oct 23 08:59:25 EDT 2002 | davef
Not familiar with "Dye Pry test".
Electronics Forum | Fri Oct 25 12:04:39 EDT 2002 | yngwie
Terry, thank you very much...& hv a nice weekend.
Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi
Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
