Electronics Forum | Fri Aug 19 05:07:00 EDT 2011 | robertwillis
Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website I will also be doing a workshop at APEX and there is a webinar
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks
Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Thu Jan 27 04:02:00 EST 2011 | richiereilly1
Hi, We had a similar issue to this. When we examined the boards at x-ray there were no apparent defects, We sent the boards for Dye and pry testing and we found that there were crack or gaps between the paste on the PCB and the BGA ball. basically th
Electronics Forum | Tue Apr 07 14:56:30 EDT 2015 | davef
Try a beer can opener, like thi: http://www.foodservicewarehouse.com/american-metalcraft/cab45/p386302.aspx?utm_medium=cpc&utm_term=American-Metalcraft-CAB45&utm_campaign=Bottle-Openers&utm_source=googlepla&source=googleps&utm_content=googlepla|mkwid
Electronics Forum | Wed Sep 21 16:23:36 EDT 2005 | 14367
I was going to ask the same question. As was mentioned, it depends on the classification of product. If it's IPC Class 3, with a requirement for high reliability, I'd want the OEM manufacturer to have a defined statement on this issue for more that
