Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen
We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl
Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Electronics Forum | Thu Feb 07 22:24:17 EST 2008 | davef
Here's another thread from the fine SMTnet Archives on dye penetrant http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17561
Electronics Forum | Wed Feb 06 22:27:05 EST 2008 | davef
While you're waiting for others to reply, read a previous posting here on SMTnet http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Thu Feb 07 22:57:29 EST 2008 | davef
The link to the IVF paper referenced in the link above seems to broken. Here's another link to it http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=363
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Electronics Forum | shellydhami |
Sat Jul 05 14:04:31 EDT 2008
Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi
Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.
Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef
It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
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