Electronics Forum: each (Page 115 of 304)

Rework units with parylene coating

Electronics Forum | Mon Jun 13 07:44:15 EDT 2005 | bandjwet

Peter: Based on our company's experience with removing a variety of different coatings, including parylene, the BGA's can be removed. We would use a chemical etch followed by a neutralizing process. We would then reflow the devices and pry them off

HOW TO REDUCE MACHINE SET-UP TIME???

Electronics Forum | Fri Jun 10 06:52:54 EDT 2005 | mmjm_1099

This sounds like exactly what I am going through here. If you come up with a nice solution please post it. One of the things I have done is make top and bottom programs similar as possible. No I didn't say all programs the same overall just each job

ESD question

Electronics Forum | Thu Jul 28 14:13:52 EDT 2005 | rsmith@z-mar.com

It is important that the ESDS device, the operator, and the work surface maintain the same elctrical potential. ESD events take place when objects of different electrical potentil come in contact with each other. When these different charges equalize

Very fishy missing solder paste issue

Electronics Forum | Tue Jul 19 12:29:20 EDT 2005 | cyber_wolf

How does the mount plane change if the surface of the board is located in the same place every time ? For example: If you put 2 boards side by side on the Y wagon : one board measures .020" and the other .200" the surfaces of the boards are going

BGA Rework Equipment

Electronics Forum | Tue Aug 15 00:46:21 EDT 2006 | ahmad

Guys I do not know what you guys are trying to prove. If you have a BGA job to be done JUST forget about using any equipment that is using hot air since you will get into a lot of trouble. It will bend the PCB and need nozzole for each IC find an ER

SMD PPM data

Electronics Forum | Fri Aug 26 21:23:38 EDT 2005 | Jes�s Salinas

Hello , In our case we take the results from the repair station. Each test station has its own repair station so from there we count the process defects : placement and printing. The formula used to calculate PPM = DEFECTS / (PARTS PER BOARD x UNITS

Reflow Oven Selection

Electronics Forum | Thu Aug 25 16:50:13 EDT 2005 | Mark

I have an application that requires soldering pieces of metal (copper plate and copper fins to make a heatsink). Each piece is about 1 lb. I cannot test it in our reflow oven (5 zone) since the piece is about 3" in height. Has anyone attempted to

solder strength

Electronics Forum | Wed Sep 07 04:40:50 EDT 2005 | Slaine

i worked for a mobile phone base station manufacturer a few years back and they had a customer in Thiland who were complaing the cabinets we sent them were dented and marked, we investigated, improved packing and goods out inspection but still had th

Pick and Place Camera sees Red

Electronics Forum | Fri Sep 16 09:39:15 EDT 2005 | electromek

We had some defective camera's on our GSM's. The repair guys wanted $12,500US for two replacements from UIC. I found rebuilds at this place in New York State for $249 each. They have been working great for two years now. I even got back $30 for the o

Tombstoning 0306's

Electronics Forum | Fri Sep 09 15:02:29 EDT 2005 | russ

What are the Mfg specs for pad layout? I had one that was wrong and we changed the center to center spacing to .032" and the width to .015" wider (.0075" on each side)than the solder terminations and everything was fine. As a general rule I never t


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