Electronics Forum: each (Page 185 of 304)

Pcb immersion tin thickness

Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef

See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti

Time to Setup a New Assembly Line

Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby

Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 11:58:54 EDT 2006 | Chunks

I believe you need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are e

MPM UP2000 Hi-e

Electronics Forum | Thu Aug 31 19:40:22 EDT 2006 | cardinal

A couple things on the Grid-Lok system. They now offer a top-side edge clamping system. The edge clamping system works very well for warped, twisted boards etc.. Using this system in the auto mode also allows the pins to contour to the geography of

MPM UP2000 Hi-e

Electronics Forum | Fri Sep 08 16:12:38 EDT 2006 | Buzz

NO! We need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are establi

T tech vs LPKF

Electronics Forum | Tue Oct 10 18:17:13 EDT 2006 | Dave from Ohio

We currently use both machines side by side in our lab now and LPKF is by far the better machine. Both are comparable systems to each other but the T-Tech machine always seems to have problems of some sort and their tech support department isn�t ve

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james

We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG

I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in

Run Fuji IP-1 at 100% speed?

Electronics Forum | Fri Sep 15 14:29:10 EDT 2006 | bvdb

Thanks "j". There is absolutely no support for Fuji in New Zealand or for the older IP-1 and MCS/2 programming computer. We got the machine working by studying the FIP-1 Operation Manual and the MCS/2 Programming manual and a lot of trial and error

Quad 4c Nozzle Height Saga

Electronics Forum | Tue Oct 10 11:06:04 EDT 2006 | lheiss

Hi All, I wasn't sure how this would turn out until I ran some production. As I suspected, after every nozzle change the machine dumps the first 3 pickups, checks the nozzle height again (function 30?) and then begins placing with correction with n


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