Electronics Forum: each (Page 194 of 305)

BGA VRAM Reworking

Electronics Forum | Mon Dec 07 16:40:37 EST 2009 | jkomets

I have a number of computer parts with faulty VRAM. I have two high-end video cards and a laptop motherboard, each worth over US$100, and some other parts worth less. They all exhibit symptoms typical of faulty VRAM; that is, they display multicolore

Temperature Profiling

Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman

In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi

A bit off-topic - pin cutting

Electronics Forum | Mon Jan 04 15:40:31 EST 2010 | dilogic

We recently got a job where (after placing SMT parts) we have to solder LED dot-matrix 8x8 display modules manually on the pcb. Due to the PCB design, it has to be TH type (also, it's the only type available) and soldered manually (or using selective

Strange things ocuring during reflow...

Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t

Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs

Selective Solder Equipment

Electronics Forum | Thu May 20 18:14:53 EDT 2010 | geocep

Process Flux is AIM 275. Tip tinning flux is Superior 75. We have gotten dual nozzles in the 6mm & 9mm sizes we run. We can get a nozzle to run about 8 hours. Every night we clean all used nozzles with a scouring pad, apply Superior 75 flux with

Philips Comet 2 part recognition

Electronics Forum | Sat Mar 20 15:59:13 EDT 2010 | emanuel

I have a big problem in setting an smd inductor camera recognition. None of the existing options in the software version 0.99B sems to work. The part is a 6x6mm with chamfer corners of 1mm on each side, looking more as an octagon. Not only this, the

ICT and specifying PCBA testing

Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway

As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa

Unusual solderability issue

Electronics Forum | Fri May 07 09:25:55 EDT 2010 | dwonch

Yes, the vias under the BGAs are the only ones capped. I tend to agree with you that the leaching should affect the bottom more than the top and that was actually the case with the two previous shops that had this problem. We suspected with those s

quad align init problem

Electronics Forum | Thu May 20 09:47:25 EDT 2010 | pforister

Is this a single head Quad IVc or a dual headed line? if it is a dual line you can swap the align cards in the front bay between the two heads and see if the symptom follows. The card on the far right is a transport card, shouldn't need to swap tha

BGA

Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk

HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi


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